CEDAR email: AGU SM024: Multiscale Plasma Convection: Mechanisms, Structures, and Effects in the MIT System

[Ying Zou]

We would like to invite you to submit an abstract to the SM024 session “
Multiscale Plasma Convection: Mechanisms, Structures, and Effects in the
Magnetosphere-Ionosphere-Thermosphere (MIT) System" at the 2021 AGU
Meeting. The conference will be hybrid from Dec 13th to 17th, 2021 in New
Orlean, LA. The abstract submissions are due 4th of August 2021, 23.59 EDT.


Session Title: SM024-- Multiscale Plasma Convection: Mechanisms,
Structures, and Effects in the Magnetosphere-Ionosphere-Thermosphere (MIT)
System


Session Link: https://agu.confex.com/agu/fm21/prelim.cgi/Session/121675


Session Description: Plasma convection in the tightly coupled
magnetosphere-ionosphere-thermosphere (MIT) system occurs at various
scales. On large-scale, plasma exhibits a two-cell or four-cell pattern
under southward or northward IMFs. Embedded in the large-scale, localized
and transient flow structures play fundamental roles in magnetic flux
transportation and energy deposition. This session solicits studies on
various MIT coupling processes associated with multi-scale plasma
convection. Relevant topics include but are not limited to: (1) flow
structures: flow channels in the auroral oval, cusp, and polar cap,
dawnside auroral polarization stream (DAPS), subauroral polarization stream
(SAPS), and penetration electric field,; (2) flow mechanisms: magnetic
reconnection, Bursty Bulk Flows (BBFs), dipolarization, particle injection;
(3) flow effects: ionospheric density structures including storm enhanced
density (SED), the tongue of ionization (TOI), polar cap patches, main
trough, and ion-neutral coupling, thermospheric wind, and heating (such as
STEVE). We encourage presentations based on observations, theories,
modeling, and machine learning.


Please do not hesitate to contact us if you have any questions. We look
forward to receiving your contributions!



Sincerely,

Banafsheh Ferdousi

Ying Zou

Ercha Aa

Don Lin
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